By ARINDAM GANGULY, OP
New Delhi: Union Electronics and Information Technology (E&IT) Minister Ashwini Vaishnaw Thursday that Odisha has huge potential in the semiconductor sector and more investment is coming in the days ahead.
Speaking at SEMICON India 2026 at Yashobhoomi in New Delhi, Vaishnaw said India was entering the next phase of its semiconductor journey with a focus on building capabilities across the entire value chain. “Odisha has a huge potential in the semiconductor sector and more investment is coming in the days ahead,” he said,
while highlighting the state’s emerging capabilities in advanced semiconductor packaging. Referring to the advanced packaging ecosystem being developed in Odisha, the minister said, “We already have a 3D packaging unit coming up in Odisha.” Vaishnaw said India’s next phase of semiconductor development, Semicon 2.0, would be built around six pillars — design, machines and materials, more fabs, advanced packaging, research and development, and talent.
He explained that in the semiconductor industry, “tape-out” refers to the stage when a chip design is sent for production. However, work on the next version begins immediately after that milestone. India’s semiconductor journey, he said, was following a similar trajectory — moving from one milestone to the next.
