New Delhi: The government is seeing investment commitments of about USD 11-12 billion under the newly-launched Semicon 2.0 scheme, IT Minister Ashwini Vaishnaw said Thursday.
The investment interest spans a wide swathe of the semiconductor ecosystem, including equipment, materials, gases, chemicals, assembly, testing, marking and packaging (ATMP) units, substrates and wafers, the minister said briefing reporters at SEMICON India 2026 event.
“The investment commitment numbers that we are seeing today, is of the order of about 11 to 12 billion dollars under Semicon 2.0,” Vaishnaw said.
Without naming the specific companies, he said the players are expected to make announcements after securing approvals from their respective boards and shareholders.
The minister said the pipeline gives the government a clear view of the investment trajectory ahead under the ambitious second phase of India’s semiconductor programme.
Vaishnaw also said Semicon 2.0 could generate close to one lakh new jobs across the semiconductor ecosystem, adding that the eventual employment creation could be higher.
The investment interest comes within weeks of the government notifying the second phase of its semiconductor programme, aimed at broadening India’s presence across the global chip value chain.
The Union Cabinet had in July approved Semicon 2.0 with an outlay of Rs 1,27,500 crore. The programme rests on six pillars covering chip design, machines and materials, semiconductor fabs, ATMP/OSAT, research and development, and talent development.
The second phase seeks to build on the first Semicon India programme, under which 12 semiconductor projects have been approved. Three of these have already commenced commercial production.
The fresh investment interest comes as India seeks to deepen its semiconductor manufacturing capabilities beyond chip packaging and establish a broader domestic supply chain encompassing materials, equipment, design and fabrication.
